• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 27/07 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common

Patent holdings for IPC class H01L 27/07

Total number of patents in this class: 907

10-year publication summary

65
81
80
109
147
119
87
62
57
21
2015 2016 2017 2018 2019 2020 2021 2022 2023 2024

Principal owners for this class

Owner
All patents
This class
Fuji Electric Co., Ltd.
4750
104
Taiwan Semiconductor Manufacturing Company, Ltd.
36809
75
Denso Corporation
23338
35
Rohm Co., Ltd.
5843
33
Toshiba Corporation
12017
31
Infineon Technologies AG
8189
31
International Business Machines Corporation
60644
30
Mitsubishi Electric Corporation
43934
28
Infineon Technologies Austria AG
1954
27
Micron Technology, Inc.
24960
25
Texas Instruments Incorporated
19376
24
Semiconductor Components Industries, L.L.C.
5345
22
Intel Corporation
45621
18
NXP USA, Inc.
4155
17
Samsung Electronics Co., Ltd.
131630
16
Toshiba Electronic Devices & Storage Corporation
1602
15
Semiconductor Energy Laboratory Co., Ltd.
10902
14
Qualcomm Incorporated
76576
13
Renesas Electronics Corporation
6305
13
GLOBALFOUNDRIES U.S. Inc.
6459
8
Other owners 328