- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/07 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
Patent holdings for IPC class H01L 27/07
Total number of patents in this class: 907
10-year publication summary
65
|
81
|
80
|
109
|
147
|
119
|
87
|
62
|
57
|
21
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Fuji Electric Co., Ltd. | 4750 |
104 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
75 |
Denso Corporation | 23338 |
35 |
Rohm Co., Ltd. | 5843 |
33 |
Toshiba Corporation | 12017 |
31 |
Infineon Technologies AG | 8189 |
31 |
International Business Machines Corporation | 60644 |
30 |
Mitsubishi Electric Corporation | 43934 |
28 |
Infineon Technologies Austria AG | 1954 |
27 |
Micron Technology, Inc. | 24960 |
25 |
Texas Instruments Incorporated | 19376 |
24 |
Semiconductor Components Industries, L.L.C. | 5345 |
22 |
Intel Corporation | 45621 |
18 |
NXP USA, Inc. | 4155 |
17 |
Samsung Electronics Co., Ltd. | 131630 |
16 |
Toshiba Electronic Devices & Storage Corporation | 1602 |
15 |
Semiconductor Energy Laboratory Co., Ltd. | 10902 |
14 |
Qualcomm Incorporated | 76576 |
13 |
Renesas Electronics Corporation | 6305 |
13 |
GLOBALFOUNDRIES U.S. Inc. | 6459 |
8 |
Other owners | 328 |